HTRB & HTGB Reliability Test
High Temperature Reverse Bias (HTRB) and High Temperature Gate Bias (HTGB) tests are essential for assessing the reliability of semiconductor components under high-temperature and high-voltage conditions. This guide explores common challenges and highlights the key features of a high-performance test bench.
Importance of HTRB & HTGB Testing
These tests replicate real-world stress scenarios by subjecting devices to elevated temperatures and voltages over extended periods. The aim is to detect potential weaknesses and ensure long-term reliability for critical applications such as automotive and industrial electronics.
Challenge in HTRB & HTGB Testing
High Voltage Stress
HTRB tests require voltages up to 1500V, necessitating specialized systems to ensure both safety and precise measurements.
Temperature Management
Maintaining stable temperatures between 100°C and 200°C is essential for accurate results and to prevent damage to the devices under test (DUTs).
Leakage Current Sensitivity
Accurately detecting gate current leakage as low as 100 µA is crucial for identifying potential early-stage failures in components.
Multi-Channel Testing and Power Dissipation
Efficient systems must handle power dissipation up to 15W per DUT while enabling scalable multi-channel testing, supporting up to 24 devices with consistent performance across all channels.
Key Tips for an Effective Test Bench
Real-time monitoring enables continuous tracking of temperature, voltage, and current using advanced software, allowing for immediate detection of anomalies during testing. Accurate voltage and current control, with systems supporting up to 1500V drain voltage and ±15V gate voltage, ensures reliable stress testing across a variety of components. Scalable multi-channel configurations allow modular systems to test multiple devices simultaneously under identical conditions, enhancing efficiency. Additionally, automated data handling streamlines the process by enabling automated acquisition and export of test data, simplifying post-test analysis and reporting.
Solutions for reliable testing
High Voltage Support
Up to 1500V for demanding stress scenarios.
Advanced Temperature Control
Stable environments between 100°C and 200°C
User-Friendly Software
Real-time monitoring and parameter control with Easystress.
Scalable Design
Supports up to 24 DUTs per chassis for increased productivity.
HTRB and HTGB testing are critical for ensuring the durability and reliability of semiconductor components in extreme conditions. By using advanced test benches with precise control and monitoring features, you can optimize testing efficiency and ensure consistent performance.
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